Grinding Machines
Setting the standard for high-production applications requiring long-term machining accuracy.
DXSG320
The DXSG320 machine can complete three processes of a production line: polishing / single-side grinding / single-side grinding. It is capable of simultaneously grinding both sides of a silicon wafer, and due to its single-wafer grinding capability, data for each wafer is traceable. Additionally, the DXSG320 supports automated wafer transportation in production lines, offering significant advantages over polishing machines and grinding discs.
Learn more about the Three Pillars of JTEKT Grinding Machines.
FERROUS SPECS
| Grinding Capacity | Notch & Orientation Flat |
| Grinding Capacity (Outer Diameter) | Ø 200 mm, Ø 300 mm |
| Grinding Wheel (Diameter) | Ø 100 mm, Ø 160 mm |
| Throughput | Within 120 sec. |
| GBIR | Within 2.0 µm |
| Thickness | Within ± 2 µm |
| Machine Weight | 5,000 kg |
NON-FERROUS SPECS
HIGH TEMP ALLOY SPECS
ACCURACY
REEQUIREMENTS
Specifications are subject to change without notice
Full Line of Grinding Machines
G1 Series
As a global leader in grinding machine technology, JTEKT Machinery offers an extensive lineup of high-performance universal, cylindrical, camshaft, and crankshaft grinding machines.
View ModelsG1 Series
G3 Series
As a global leader in grinding machine technology, JTEKT Machinery offers an extensive lineup of high-performance universal, cylindrical, camshaft, and crankshaft grinding machines.
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ID Grinders
High Accuracy Internal Cylindrical Grinding Machines
Straight-type with 5 wheel pattern configurations
Workpiece Length:
19.6" (500 mm) to 78.7" (2,000 mm)
Workpiece Swing:
Ø 12.6" (320 mm) to 15.75" (400 mm)
Universal OD Grinders
Manually-Swivelable Wheelhead
Plain Head, 30º, or 45º Angle Positions
Between Centers:
19.69" (500 mm) to 78.7" (2,000 mm)
Swing: Ø12.6" (320 mm)
Weight Capacity: 330 lb
Universal OD Grinders (cont.)
Manually-Swivelable Wheelhead
Plain Head, or 30º, Angle Positions
Between Centers:
39.4" (1,000 mm) to 157.4" (4,000 mm)
Swing: 25.9" (660 mm)
Weight Capacity: 3,300 lb
Universal OD Grinders (cont.)
Manually-Swivelable Wheelhead
Plain Head, or 30º, Angle Positions
Between Centers:
39.4" (1,000 mm) to 157.4" (4,000 mm)
Swing: 25.9" (660 mm)
Weight Capacity: 3,300 lb
Universal OD Grinders (cont.)
GE Series OD Grinders
Job Shop High Accuracy OD Cylindrical Grinding Machines
Dedicated Plain or Angle Head Configuration
Between Centers:
59" (1,500 mm) to 157.4" (4,000 mm)
Swing: Ø22" (560 mm)
Weight Capacity: 1,100 lb
GL Series OD Grinders
Production Highspeed OD Cylindrical Grinding Machines
Dedicated Plain or Angle Head Configuration
Between Centers:
12.6" (320 mm) to 59" (1,500 mm)
Swing: Ø12.6" (320 mm) to Ø15.7" (400 mm)
Weight Capacity: 330 lb to 660 lb
GL Series OD Grinders (cont.)
Production Highspeed OD Cylindrical Grinding Machines
Dedicated Plain or Angle Head Configuration
Between Centers:
24.8" (630 mm) to 98.4" (2,500 mm)
Swing: Ø15.7" (400 mm)
Weight Capacity: 660 lb
GL Series OD Grinders (cont.)
E Series OD Grinders
Dual-Center Drive Highspeed OD Grinding Machines
Dedicated Plain or Angle Head Configuration
Between Centers: 11" (280 mm)
Swing: Ø7.9" (200 mm) to Ø11" (280 mm)
Weight Capacity: 11 lb
E Series OD Grinders
Camshaft Grinders
Highspeed, High Accuracy Cam Lobe Grinding Machines
Between Centers:
13.8" (350 mm) to 78.7" (2,000 mm)
Swing: Ø12.6" (320 mm)
CBN Wheel Specification
Crankshaft Grinders
Highspeed, High Accuracy Crank Pin Grinding Machines
Between Centers:
9.84" (250 mm) to 55.1" (1,400 mm)
Swing: Ø6.29" (160 mm) to 19.7" (500 mm)
CBN Wheel Specification
Semiconductor Grinders
Manual Grinders
Manual Hydraulic OD Cylindrical Grinding Machines
Between Centers:
19.7" (500 mm) to 59" (1,500 mm)
Swing: Ø12.6" 320 mm
Weight Capacity: 330 lb