DXSG320

With its ability to grind wafers from as-sliced condition to ±1 micron accuracy, the DXSG320 ensures superior flatness and thickness uniformity. The air static pressure bearings and built-in motor on the grinding wheel spindle provide ultra-stable rotation, high speed, and unrivaled accuracy. By removing equal stock from both sides of the wafer in a single operation, the DXSG320 eliminates the need for additional polishing or grinding equipment, ensuring consistent quality across every wafer.

Compact, Efficient, and Productive
The DXSG320 is designed with a 20% smaller footprint compared to competitive wafer processing machines, yet integrates fully automated internal work handling. This compact design not only saves valuable floor space but also streamlines wafer transfer and handling, enabling smooth integration into existing production lines.