R631BM / R631DF

The R631BM / R631DF is a specialized high-precision grinder developed to process hard and brittle wafers, offering an advanced alternative to conventional lapping machines. Designed for today’s demanding semiconductor applications, this vertical single-disc grinder delivers outstanding accuracy, reliability, and repeatability, even with difficult-to-grind materials. Its fully automated cassette-to-cassette handling system ensures seamless wafer transfer, while grinding parameters for each wafer are stored individually—providing full traceability and process control.